Printed Circuit Board Via Filling – With Reference To IPC-4761 Type IV/ IV-a:Use anti-soldering ink over plug material covering one side of via.Able to manufacture? Yes. Type IV/ IV-b:Use anti-soldering ink over plug material covering both side of via.Able to manufacture? Yes. Type V:Make via hole as double-sided window, fill plug material to via with resin material, but without metallized coating.Able to manufacture? Yes, only when a fill material is specified as anti-soldering. Type VI/ VI-a:Cover one side with anti-soldering ink, fill plug material to via with resin material, but without metallized coating (type V based, with extra masking material on one side).Able to manufacture? Yes, only when a fill material is specified as anti-soldering. Type VI/ VI-b:Cover one side with anti-soldering ink, fill plug material to via with resin material, but without metallized coating via (type V based, with extra masking material on both sides)Able to manufacture? Yes, only when a fill material is specified as anti-soldering. Type VII:Fill plug material to via with resin material, cover via with metallized coating (type V based, with metallized coating).Able to manufacture? Yes. By prodigye|January 15th, 2021|Blog Post|0 Comments Share This Story, Choose Your Platform! FacebookXRedditLinkedInWhatsAppTelegramTumblrPinterestVkXingEmail About the Author: prodigye Related Posts Wearable device to fight the pandemic Gallery Wearable device to fight the pandemic Crisis in Printed Circuit Board supply Gallery Crisis in Printed Circuit Board supply About PCI Compliance Gallery About PCI Compliance